Printed Circuit Board (PCB) design is an essential part of the electronics design process. However, even experienced engineers and designers can make mistakes that can result in manufacturing issues and high costs. In this article, we will go over 21 common design mistakes to avoid when designing a PCB for mass manufacturability.
Poor Trace Routing: Poor routing of the trace can result in high crosstalk and impedance mismatches.
Using the Wrong Trace Width: Using the wrong trace width can cause issues with high current and result in overheating.
Incorrect Component Placement: Incorrect component placement can result in manufacturing difficulties and poor electrical performance.
Not Enough Space Between Components: Not leaving enough space between components can result in manufacturing difficulties and potential electrical issues.
Not Considering Heat Dissipation: Not considering heat dissipation can result in overheating and possible damage to the components.
Not Providing Enough Ground Planes: Not providing enough ground planes can result in high noise levels and poor electrical performance.
Ignoring Signal Integrity: Ignoring signal integrity can result in poor signal quality and potential data errors.
Not Using Vias Properly: Not using vias properly can result in manufacturing difficulties and potential electrical issues.
Using Non-Standard Hole Sizes: Using non-standard hole sizes can result in manufacturing difficulties and high costs.
Not Providing Enough Clearance for Assembly: Not providing enough clearance for assembly can result in manufacturing difficulties and high costs.
Not Providing Enough Clearance for Testing: Not providing enough clearance for testing can result in testing difficulties and high costs.
Not Providing Enough Space for Components: Not providing enough space for components can result in manufacturing difficulties and potential electrical issues.
Not Using Surface Mount Components: Not using surface mount components can result in manufacturing difficulties and high costs.
Not Considering Environmental Factors: Not considering environmental factors can result in reliability issues and potential failure.
Not Considering EMI/EMC: Not considering Electromagnetic Interference (EMI) and Electromagnetic Compatibility (EMC) can result in high noise levels and potential electrical issues.
Not Considering ESD Protection: Not considering Electrostatic Discharge (ESD) protection can result in component damage and potential failure.
Not Considering Power Distribution: Not considering power distribution can result in high noise levels and potential electrical issues.
Not Considering Grounding: Not considering grounding can result in high noise levels and potential electrical issues.
Not Using Proper Layer Stackup: Not using proper layer stackup can result in manufacturing difficulties and potential electrical issues.
Not Considering Test Points: Not considering test points can result in testing difficulties and high costs.
Not Considering Cost: Not considering cost can result in high manufacturing costs and potential profit loss.
By avoiding these common design mistakes, you can ensure that your PCB design is optimized for mass manufacturability. Taking the time to carefully consider these factors can help you to create a design that is both reliable and cost-effective.